Conductive Wire Glue/Paint - NO Soldering Iron

Product Information

Henkel’s LOCTITE ® ECCOBOND line of snap curable conductive adhesives provide excellent adhesion and reliability, cure times of less than two minutes, and in-line processing capability for exceptionally high throughput. In addition, some offer improved thermal conductivity to help with thermal management of electronic components and heat sinks, directing heat away from sensitive components. The pen contains a silver loaded polymer which can be used to repair faulty tracks, link components, make smooth jumpers and shield delicate electronics. Lower curing temperatures of ECAs will protect sensitive electronic components without compromising the functionality of the electronic assembly. Paste viscosity materials have fast tack free speed, flexibility and high temperature resistance up to 400°F for use in bonding, gasketing, EMI/RFI shielding.

ESQT-128-02-L-D-420 Molex 2210506093 Amphenol Industrial Operations 97-3106A32-414PX-940 TE Connectivity AMP Connectors 2195846-6 KYOCERA AVX 08053C333KAT2A KOA Speer Electronics, Inc.g. two component mix and then room temperature cure, or heat cure – if the application involves temperature-sensitive components, is a heat cure suitable? If you merely lay them side by side without touching and then glue them, the resistance of the glue joint will be in 7-9 ohm range.

Certain temperature-sensitive electronic components cannot be soldered because the intense heat of liquid solder and the soldering iron can cause damage to the component. Addition cured two part systems have convenient one to one mix ratios, long working life, low shrinkage and cure at ambient temperatures or more quickly at elevated temperatures.

While this is not that good for running power to the main circuit, it quite fine to run digital signals or to light LEDs. Combine this property with flexible resin bases and Henkel offers a wide range of solutions in application where EMI shielding is of upmost importance.